Chip Die Model

Interactive 3D • Hierarchical Segmentation

Tiled Die Architecture
Primary 2×2 division • NW: 4 sub-cores • NE: 2 parallel cache banks
LIVE 3D
Drag to rotate • Scroll to zoom • Click to inspect
RESOLUTION • 4K READY
Chip Segments
8 BLOCKS
Selection Details
Click any colored segment in the 3D view or in the legend above to see detailed specifications and function.
Die Specifications
Process Node
3 nm
Die Size
~ 320 mm²
Transistor Count
~ 42.8 B
Power Envelope
125–250 W

Layout interpretation: The square die is first separated into four main quadrants by a central cross. The top-left quadrant (CPU complex) is further subdivided into four equal sub-segments (Cores 0–3). The adjacent top-right quadrant is divided into two vertical segments (L3 Cache Banks A & B) using a vertical dividing line parallel to the vertical subdivisions used in the four-core cluster.

The bottom two quadrants remain as large monolithic tiles: Integrated GPU (SW) and System Agent / I/O (SE). This creates a realistic modern chip floorplan with hierarchical partitioning for power, thermal, and manufacturing zones.